Bergquist GapPadHC1000无基材间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

GapPadHC1000可供规格：

厚度(Thickness)：10mil 15mil 20mil /228.6mm×76.2m

片材(Sheet)：8”×16”(203 mm×406 mm)

卷材(Roll)：9”×250’

导热系数(Thermal Conductivity)：1.0W/m-k

基材(Reinfrcement Carrier)：玻璃纤维

胶面(Glue)：双面自带粘性

颜色(Color)：灰色

包装(Pack)：美国原装进口包装。

抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞5000

持续使用温度（Continous Use Temp）：-60°~200°

GapPadHC1000应用材料特性：

GapPadHC1000是无基材结构，增强服贴性，服贴，低硬度，电气绝缘

GapPadHC1000材料说明：

GapPadHC1000是一款无基材的含有优质低模量填充复合物的导热材料，在保留优秀的导热性能的同时，加工和装配也非常方便，这材料双面具有天然粘性，可以与相邻的元器件表面进行良好的贴合，大大减少了界面热阻。

GapPadHC1000典型应用：

计算机和外设、通讯设备、功率变换设备、RDRAM^TM存储模块/芯片级封装、需要将热量传递到机架、机箱或其它散热装置的场合

GapPadHC1000技术优势分析：

GapPadHC1000是一款常用的导热绝缘材料。其广泛用于中国大陆地区，因此材料本身的性能与质量已经得到市场的认可。GapPadHC1000是一款性价比很好的导热绝缘材料。导热系数1.0W，出于导热材料中中等水平，价格却相对较低，并且有8种厚度可供用户选择。

Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.

通讯设备

需要将热量传递到机架、机箱或其它散热装置的场合

RDRAM^TM存储模块

在不平整表面和散热器之间作为导热界面

DDR SDRAM存储模块

全缓冲内存（FBDIMM）模块