Bergquist Gap Pad 1500无基材间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

Gap Pad 1500可供规格：

厚度(Thickness)：20mil 40mil 60mil 80mil 100mil 125mil 160mil 200mil

片材(Sheet)：8”×16”(203 mm×406 mm)

卷材(Roll)：无

导热系数(Thermal Conductivity)：1.5W/m-k

基材(Reinfrcement Carrier)：玻璃纤维

胶面(Glue)：双面自带粘性

颜色(Color)：黑色

包装(Pack)：美国原装进口包装。

抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞6000

持续使用温度（Continous Use Temp）：-60°~200°

GapPad1500应用材料特性：

GapPad1500是无基材结构，增强服贴性，服贴，低硬度，电气绝缘

GapPad1500材料说明：

GapPad1500是一款无基材的含有优质低模量填充复合物的导热材料，在保留优秀的导热性能的同时，加工和装配也非常方便，这材料双面具有天然粘性，可以与相邻的元器件表面进行良好的贴合，大大减少了界面热阻。

GapPad1500典型应用：

计算机和外设、通讯设备、功率变换设备、RDRAM^TM存储模块/芯片级封装、需要将热量传递到机架、机箱或其它散热装置的场合

GapPad1500技术优势分析：

GapPad1500是一款非常常用的导热绝缘材料。其广泛用于中国大陆地区，因此材料本身的性能与质量已经得到市场的认可。GapPad1500是一款性价比极高的导热绝缘材料。导热系数1.5W，出于导热材料中中等水平，价格却相对较低，并且有8种厚度可供用户选择。

Gap Pad® 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.Gap Pad® 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.Gap Pad® 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.Gap Pad® 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

功率变换设备

RDRAM^TM存储模块/芯片级封装

需要将热量传递到机架、机箱或其它散热装置的场合